| 1. | Silicon slices and wafers - measuring of diameter - micrometer method
硅片直径测量方法千分尺法 |
| 2. | Test method for measuring warp on silicon slices by nontact scanning
硅片翘曲度非接触式测试方法 |
| 3. | Test methods for bow of silicon slices
硅片弯曲度测试方法 |
| 4. | Silicon slices and wafers - measuring of diameter - optical projecting method
硅片直径测量方法光学投影法 |
| 5. | Test method for thickness and total thickness variation of silicon slices
硅片厚度和总厚度变化测试方法 |
| 6. | Standard method for measuring radial resistivity variation on silicon slices
硅片径向电阻率变化的测量方法 |
| 7. | Standard method for measuring the surface quality of polished silicon slices by visual inspection
硅抛光片表面质量目测检验方法 |
| 8. | Wafers silicon slices
晶片锗片 |
| 9. | It fits smd surface crystal , optic crystal , optic glass , semiconductor silicon slice , quartz crystal slice , piezoelectricity porcelain , arsenide gallium , linb03 , molybdenum slice and metal , nonmetal brittleness material both single side polishing and rubbing of pressurizing cmponets
本机主要适用于硅片、石英晶片、 smd表面贴装晶体、光学水晶、铌酸锂、玻璃、陶瓷片等薄脆金属或非金属材料的双面研磨或抛光。 |
| 10. | This method has some characters : during recording of the transmissive holograms the holographic grating placed in front of the holographic plate closefittingly is used as a spectroscope . the transmissive wave is served as the object wave and the diffraction wave through the holographic grating or the deflective reflect wave produced by the silicon slice is served as the reference wave , therefore the hologram is named as self - reference image hologram . the recording results are the off - axis holograms and the twin images can be separated successfully
在记录透射型全息图时，将全息光栅紧贴置于记录干板之前，而光栅起到了分光的作用，直透波作为全息图的物光波，参考光是物光通过光栅后产生的衍射波；记录反射型全息图时将硅片置于记录干板之后，利用反射硅片产生离轴参考光，因此系统仅需一束照明光束，参考光来自物光本身，因此称之为自参考像全息图。 |
